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fky3c64x - h 3 flush mount through - hole type lens color : pale yellow, clear standard product reference sheet features package page : 1 ? blowhole - free structure blowhole is a type of defect which mostly occurs in direct mounting led. moisture absorbed by pcb during soldering, might get vaporization and puncture holes in solder. blowhole - free is a new structure which can prevent the occurrence of blowhole. ? lead C free soldering compatible ? rohs compliant ? communication machine, electric household appliances, oa/fa, other general applications recommended applications product features 2014.09.22
fky3c64x - h unit :mm weight :160mg outline dimensions notes: 1. the lead should be bent 1.6mm away from the root. 2. iron material is exposed at the tie - bar cutting part. 3. the minimum packing unit is 200 pieces. page : 2 2014.09.22 no. part name materials lead iron pb free dip soldering encapsulant epoxy resin
fky3c64x - h specifications page : 3 2014.09.22 die material emitting colpr please refer to page 9, handling precaution of flush mount led lamp,soldering precaution for details. i f 50 ma i frm 1.33 ma/ algainp yellow - 40 +85 v t sld operating temperature notes2 notes1 notes3 esd testing method : eiaj4071/300(304) human body model(hbm) 1.5k ,100pf i frm 100 t opr reverse voltage v r 5 (ta=25 ) product overview resin color 265 note 1 note 3 note 2 i frm conditions pulse width Q 1ms , duty Q 1/20 esd storage temperature t stg item i f derate linearly from "25 " 125 repetitive peak forward current soldering temperature "dip soldering" electrostatic discharge threshold "hbm" 1,000 v - 40 +100 power dissipation p d i frm derate linearly from "25 " symbol maximum ratings units mw pale yellow, clear forward current i f 0.67 ma/ ma absolute maximum ratings
fky3c64x - h specifications page : 4 2014.09.22 item units nm ? i f = 20ma spectral line half width symbol conditions i r i f = 20ma 1.8 2.3 nm 5,600 - mcd v f 2.5 (ta=25 ) i f = 20ma v min. typ. max. electro and optical characteristics i v 1,000 v r = 5v - 500 - - 100 i f = 20ma 582 20 d 590 597 - nm - dominant wavelength peak wavelength luminous intensity reverse current forward voltage p a 592 i f = 20ma rank marking luminous intensity rank is indicated by lot number on the product label. 1,400 i v (mcd) max. c f 1,000 1,400 2,000 leds shall be sorted out into the following 6 ranks of luminous intensity. sorting chart for luminous intensity rank condiiton i f = 20ma ta = 25 e 2,000 4,000 d 500 700 min. 2,800 2,800 5,600 a b 1,000
fky3c64x - h 0.0 0.2 0.4 0.6 0.8 1.0 1.2 380 430 480 530 580 630 680 730 780 relative intensity vs. dominant wavelength condition: ta = 25 , i f =20ma wavelength: (nm ) relative intensity spatial distribution condition: ta = 25 , i f =20ma relative intensity : ( %) technical data page : 5 100 50 0 50 100 0 30 6 0 90 - 30 - 60 - 90 100 50 2014.09.22
fky3c64x - h 0.1 1.0 10.0 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 10 20 30 40 50 60 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 -40 -20 0 20 40 60 80 100 0.1 1 10 100 1.0 1.5 2.0 2.5 3.0 forward voltage vs. forward current condition : ta = 25 forward voltage: v f (v ) forward current: i f (ma) ambient temperature vs. relative intensity condition: i f = 20ma ambient temperature: ta ( ) forward current vs. relative intensity condition: ta = 25 forward current: i f (ma) ambient temperature vs. forward voltage condition: i f = 20ma ambient temperature: ta ( ) forward voltage: v f (v) relative intensity relative intensity technical data page : 6 2014.09.22
fky3c64x - h 1 10 1 10 100 1,000 10,000 100,000 50hz 100hz 1khz 10khz 2 575 580 585 590 595 600 -40 -20 0 20 40 60 80 100 cie 575 580 585 590 595 600 0 10 20 30 40 50 cie 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 ambient temperature vs. power dissipation ambient temperature: ta ( ) pulse width vs. maximum tolerable peak current condition: ta = 25 pulse width : tw ( s ) technical data forward current vs. dominant wavelength condition : ta = 25 forward current : i f (ma) power dissipation : pd ( mw ) ambient temperature vs . dominant wavelength condition: i f = 20ma ambient temperature: ta ( ) page : 7 dominant wavelength : d (nm) dominant wavelength : d (nm) i f peak max. / i f dc max. 2014.09.22
fky3c64x - h 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 duty=5% duty=10% duty=20% duty=50% dc 1 10 100 1,000 1 10 100 max. forward current vs. duty cycle condition: ta = 25 duty cycle: (%) maximum forward current : i fmax . (ma) maximum forward current : i fmax . (ma) technical data ambient temperature vs. max. forward current repetition frequency : f R 50hz ambient temperature: ta ( ) page : 8 2014.09.22
fky3c64x - h soldering conditions 1 soldering precaution 1) please avoid dipping the resin directly into the solder bath. 2) please do not apply the heat of 100 or more to the resin. 3) any shock or vibration to the led resin body should be avoided after soldering for the resin is soft and easily to be damaged until it return to room temperature. 4) heating up for temporarily fix of other surface - mounting device should be done under 100 . avoid any pressure to the frame and resin part of led. 2 recommendation condition of soldering 1) soldering iron the number of manual soldering process shall be 2 times max. cooling process to room temp. is required between first and second manual soldering process. temperature at tip of iron 400 max. soldering time 3s max. position at least 1.6mm away from the root of lead 2) dip soldering pre - heating resin surface temperature should be set under 100 . bath temperature 265 max . dipping time 5s max. position at least 1.6mm away from the root of lead. the number of dip soldering process shall be 2 times max. cooling process to room temp. is required between first and second dip soldering process. soldering positioning note through hole board is not recommended because soldering position will become 0 mm. 5) the tie - bar cutting part might get oxidized because iron has been exposed. please avoid soldering on the tie - bar part, because the solderability decreases when oxidization occurs. when the soldering part and die - bar cutting part overlaps, please confirm the solderability before using. page : 9 both sides through hole board one side board 3) reflow soldering not recommended (however, if led lamp and other electronic components are soldered together and the temperature of resin can be controlled within 100 , reflow soldering is acceptable.) 2014.09.22
fky3c64x - h solvent adaptability isopropyl alcohol pure water acetone thinner 1. cleaning 1 some chemicals could corrode, oxidize cloud or crack the optical characteristics of the lens. please review the reference chat below carefully before cleaning. ? dipping time: 3 minutes max .(at room temperature) note ? if pure water is used, please refer to 4 ). effect of ultrasonic cleaning on the led will vary on such factors as the oscillator output, capacity ,size of p.c.b and led mounting method, etc. c leaning should be done after confirming that there is no problem during actual usage with ultrasonic cleaning . 2 3 freon substitute detergent could corrode, oxidize, cloud or crack the resin of led, please ensure that there is no problem before using it. 4 if water needs to be used for cleaning, please use pure water(not tap water), and completely dry the component. freon substitute detergent ? clean through - 750h ? pine alpha st - 100s handling precaution page : 10 2014.09.22
fky3c64x - h 2. lead forming 2 the lead frame should be bent at a point 1.6mm away from the root of lead. please perform at room temperature. during forming, a jig or radio pliers should be firmly fixed to the root of lead, to which no mechanical stress should be applied. 1 3 4 5 all forming must be performed prior to soldering. forming pitch should be adjusted to the device insertion hole - pitch on the pcb. please avoid bending at the tie - bar part of lead during foaming because t here is possibility that the stable forming shape can not be formed. 3. led mounting method 1 2 3 please avoid excessive stress to lead frames during mounting. mounting should be performed at room temperature. 4 please fix the led within the casing using the lead, and do not use adhesives, resin, or any other materials to fix the led position. cathode 15 min . anode 45 min. pusher pressure 0.2mpa max. tie - bar portion clinch angle handling precaution to determine mount positions of leds using a case, please take into account the dimensions of the casing, board , device to avoid excessive stress on the lead. with regard to using an inserter (automation), please adjust the insertion pressure to the lowest possible setting, and minimize the clinch angel as for as it can hold the component. lead width holes between pitches on board 0.4mm 0.7 1.0mm page : 11 2014.09.22
fky3c64x - h basic design 1.1 designing for safety all led lamps are designed to operate without failure in recommended usage conditions. however, all semiconductor components are prone to unexpected malfunctions and failures. please take the necessary precautions to prevent fire, injury and other damage should any malfunction or failure arise. 1.2 absolute maximum r ating absolute maximum ratings are set to prevent led lamps from failing due to excess stress (temperature, current, voltage, etc.). usage conditions must not exceed the ratings for a moment, nor do reach one items of absolute maximum rating simultaneously. 1.3 actual usage design in order to ensure high reliability from led lamps, variable factors that arise in actual usage conditions should be taken in account for designing.( derating of typ., max forward voltage, etc.) 1 2 3 please insert straight protective resistors into the circuit in order to stabilize led lamp operation and also to prevent the device from igniting due to excess current. if leds need to be used in a matrix circuit, a fully understanding of leds characteristics is required for designing.. this led lamps should be used with current of 2ma or more. if using led lamps with current over 2 ma, it might vary considerably in chromaticity, luminous intensity, forward current. so current of 2ma or more is recommended considering the optimization of product selection and protective resistors. the others once the package is open, please use as soon as possible, as keeping an opened package for a long time could cause the lead frame to oxidize. for storage, please avoid wetness and humidity, while taking care to avoid condensation caused by rapid temperature changes. 1 2 3 4 5 6 8 7 in case of product failures, the lot number on the product package label will be helpful in speeding up our response action. please refrain from looking directly at the light sauce of led lamp at high output, as it may harm your vision. stanley led lamps have semiconductor characteristics and are designed to ensure high reliability. however, the performance may vary depending on usage conditions please check the actual performance in the assembly because the specification sheets are described for single led. the products are manufactured to be used for ordinary electronic equipment. please contact our sales staff beforehand when exceptional quality and reliability are required, and the failure or malfunction of the products might directly jeopardize life or health ( such as for airplanes, aerospace, transport equipment, medical applications, nuclear reactor control systems and so on). if the actual using condition is different from stanleys recommended conditions on this specification, please verify led lamps performance under actual conditions to ensure there is no problem before actual use. the formal specification sheets shall be valid only by exchange of documents signed by both parties. handling precaution page : 12 2014.09.22
fky3c64x - h packaging specifications label front side back side label specification [ acc.to jis - x0503(code - 39 )] note " " only appears when customer parts number is different form stanley parts number. product label a. parts number b. bar - code for parts number c. parts code (in - house identification code for each parts number) d. packed parts quantity e. bar - code for packed parts quantity f. lot number & rank (refer to lot number notational system for details ) g . qr - code for internal management h . customer parts number package page : 13 2014.09.22
fky3c64x - h 1 package conditions: c lear plastic bag , 200p cs. / bag. 2 warranty period : with in 12 months under following conditions. un - opened, at normal temperature / normal relative humidity ( +5 +30 / 70%rh.max. ). note1 the solderability of terminals of led might decrease if above warranty period expired. note2 terminals of led might get oxidized which will decrease the solderability of terminals if the products are stored with cardboard and rubber. the products should be isolated from these in keeping. note3 due to convenience of shipping and transportation, stanley use cardboard box to shipping products during transportation. cardboard contains sulfur element which will corrode silver plating. please take the products out of the cardboard box for long term storage . note4 excess press to the package bag which might deform the lead part of leds should be avoided. page : 14 packaging specifications package 2014.09.22
fky3c64x - h packaging specifications 3 inner packing b ox . ? the above measures are all reference values. note ? the box is selected out of the above table by shipping quantity and product size. ? package materials are filled into the box to keep products form moving. a .customer name b .parts type c .parts code d .parts number e .packed parts quantity f .carton number g .shipping date h .bar - code for in - house identification number i .customer parts number opto devices /seal adhesive tape notes the above figure is a representative example. the way that how adhesive tape is applied differs by the box type. " " only appears when customer parts number is different form stanley parts number. a b page : 15 2014.09.22 box type box type outline dimension l w h ( mm ) a1 195 117 38 304 224 46 390 210 65 a4 head outline dimension l w h ( mm ) b2 b3 495 230 150 310 225 105
fky3c64x - h packaging specifications 4 outer packing box. note the above figure is a representative example. the way that how adhesive tape is applied on the box differs by the box type. a ? the above measure are all reference value. note ? the box is selected out of the above table by shipping quantity and product size. ? package materials are filled into the box to keep products form moving adhesive tape page : 16 2014.09.22 outline dimension l w h ( mm ) l w h ( mm ) outline dimension 320 230 150 5p head 390 210 65 g1 480 340 225 2p 410 150 230 g2 480 340 320 g4 sh-1 led-c 505 255 315 400 335 225 10p 400 335 450 510 255 165 box type box type
fky3c64x - h lot number notational system - 1digit production location (mark identify alphabet) - 1digit production year (last digit of production year 2009 9,2010 0,2011 1, ??? ) - 2digit production month (jan. to sep. , should be 01,02,03, ????? ) - 2digit production date - 3digit serial number - 2digit tape and reel following number - 2digit luminous intensity rank. (if luminous intensity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate .) - 2digit chromaticity rank ( if chromaticity rank is 1 digit, " - " shall be dashed on the place for the second digit. if there is no identified intensity rank, " - - " is used to indicate.) - 1digit option rank ( stanley normally print " - " to indicate) page : 17 2014.09.22
fky3c64x - h correspondence to rohs ? elv instruction this product is in compliance with rohs ? elv. prohibition substance and it's criteria value of rohs ? elv are as follows. ? rohs instruction refer to following (1) (6). ? elv instruction . refer to following (1) (4). substance group name criteria value (1) lead and its compounds 1,000ppm max (2) cadmium and its compounds 100ppm max (3) mercury and its compounds 1,000ppm max (4) hexavalent chromium 1,000ppm max (5) pbb 1,000ppm max (6) pbde 1,000ppm max page : 18 2014.09.22
fky3c64x - h reliability testing result 1.reliability testing result 2.failure criteria page : 19 2014.09.22 testing items applicable standard testing conditions room temp. operating life eiaj ed- 4701/100(101) ta = 25 , i f = maxium rated current, t = 1,000h resistance to soldering heat eiaj ed- 4701/300(302) 260 5 , 10s, 3mm from package base temperature cycling eiaj ed- 4701/100(105) minimum rated storage temp.(30min) normal temp.(15min) maximum rated storage temp.(30min) normal temp.(15min) 5 cycles wet high temp. storage life eiaj ed- 4701/100(103) ta = 602 , rh = 905%, t = 1,000h high temp. storage life eiaj ed- 4701/200(201) ta = maximum rated storage temp. low temp. storage life eiaj ed- 4701/200(202) ta = minimum rated storage temp. lead tension eiaj ed- 4701/400(401) 10n, 10s, 1time vibration, variable frequency eiaj ed- 4701/400(403) 98.1m/s 2 (10g), 100 2khz sweep for 20min., xyz each direction, 2h of each direction items symbol conditions failure criteria luminous intensity i v ta=25 i f =20ma testing min. value spec. min. value x 0.5 forward voltage v f ta=25 i f =20ma testing max. value R spec. max. value x 1.2 reverse current i r ta=25 v r =4v testing max. value R spec. max. value x 2.5 cosmetic appearance - - occurrence of notable decoloration, deformation and cracking
fky3c64x - h special notice to customers using the products and technical information shown in this data sheet 1) the technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. it does not constitute the warranting of industrial property nor the granting of any license. 2) for the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. therefore it is recommended that the most updated specifications be used in your design. 3) when using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. we are not responsible for any damage which may occur if these specifications are exceeded. 4 ) the products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (oa equipment, telecommunications equipment, av machine, home appliance and measuring instrument). the application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except oa equipment, telecommunications equipment, av machine , home appliance and measuring instrument. 5) in order to export the products or technologies described in this data sheet which are under the foreign exchange and foreign trade control law, it is necessary to first obtain an export permit from the japanese government. 6) no part of this data sheet may be reprinted or reproduced without prior written permission from stanley electric co., ltd. 7) the most updated edition of this data sheet can be obtained from the address below: http:// www.stanley - components.com/en/ page : 20 2014.09.22

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